Title:
MEMS SOUND SENSOR, MEMS MICROPHONE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/133334
Kind Code:
A1
Abstract:
Disclosed is an MEMS sound sensor, comprising: a substrate; and a first sound sensing unit and a second sound sensing unit arranged on the substrate, wherein the first sound sensing unit is used for detecting a sound by means of at least one of an air sound pressure change and a mechanical vibration; the first sound sensing unit comprises a first back plate, and a first vibration diaphragm arranged opposite the first back plate and with a gap between same and the first back plate; the first vibration diaphragm and the first back plate form a capacitance structure; the substrate is provided with a first back hole to expose the first vibration diaphragm, and a first connecting post to hang the first vibration diaphragm on the first back plate; an edge area of the first vibration diaphragm is provided with at least one mass block; and the first back plate is provided with an opening.
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Inventors:
HO HSIEN-LUNG (CN)
HSIEH KUAN-HONG (CN)
CHIU SHIH-CHIA (CN)
HSIEH KUAN-HONG (CN)
CHIU SHIH-CHIA (CN)
Application Number:
PCT/CN2018/125301
Publication Date:
July 02, 2020
Filing Date:
December 29, 2018
Export Citation:
Assignee:
GETTOP ACOUSTIC CO LTD (CN)
International Classes:
H04R31/00; B81C1/00; H04R19/04
Foreign References:
| CN102822084A | 2012-12-12 | |||
| CN102822084A | 2012-12-12 | |||
| CN108513241A | 2018-09-07 | |||
| CN108513241A | 2018-09-07 | |||
| US20090280594A1 | 2009-11-12 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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