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Patent Searching and Data


Title:
METAL-BASED ENCAPSULATING MATERIAL FOR ORGANIC LIGHT EMITTING DIODE, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/038295
Kind Code:
A1
Abstract:
The present invention relates to a metal-based encapsulating material for an organic light emitting diode, the encapsulating material comprising: a metal layer; and a nickel-containing plating layer selectively provided on the top portion, the bottom portion, or the top and bottom portions of the metal layer. The metal-based encapsulating material according to the present invention can efficiently block the penetration of moisture and oxygen into the organic light emitting diode while protecting the organic light emitting diode.

Inventors:
KIM WY YONHG (KR)
PARK JONG HYUN (KR)
LEE SANG KYU (KR)
KIM DEA GEUN (KR)
CHUNG BO MOOK (KR)
JANG WONBONG (KR)
Application Number:
PCT/KR2022/011248
Publication Date:
March 16, 2023
Filing Date:
July 29, 2022
Export Citation:
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Assignee:
YMT CO LTD (KR)
International Classes:
H01L51/52
Foreign References:
KR20170075072A2017-07-03
KR20210017223A2021-02-17
KR20160078802A2016-07-05
KR20150074996A2015-07-02
JP2003229248A2003-08-15
Attorney, Agent or Firm:
KWAK, Hyun Kyu (KR)
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