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Title:
METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/122585
Kind Code:
A1
Abstract:
Provided is, inter alia, a metal-clad laminate that exhibits low variation in dimension change rate and that makes it possible to reduce any variation in the amount of warping in a semiconductor package. This metal-clad laminate comprises a metal foil, and a cured article of one or more prepregs, the average thickness of the metal-clad laminate as measured in accordance with the method described below using a laser displacement sensor being 400 μm or greater, and the value calculated using formula (1) being 0.70% or lower. Formula (1): (average value of standard deviation of thickness derived according to measurement method)×100/(average thickness of metal-clad laminate). (Method for measuring thickness of metal-clad laminate) To measure the thickness, four measurement boards, each of which is sized to 60 mm long by 60 mm wide in a planar direction, are cut out from a desired location in the metal-clad laminate. The start point and end point in measurement are not positioned at the ends of the metal-clad laminate, and the thickness is measured at 1-mm intervals on two diagonal lines. The standard deviation for each of the four measurement boards is derived from the thickness of all measured points, after which the average value of the standard deviation of the thickness in each of the four measurement boards is derived. Furthermore, the average thickness of all measured points in the four measurement boards is calculated, and the result of calculation is employed as the average thickness of the metal-clad laminate. The details are as set forth in the description.

Inventors:
TONOUCHI SHUNSUKE (JP)
KITAJIMA TAKAYO (JP)
MAGOTA SEIYA (JP)
NAKANISHI KOTA (JP)
FUJITA HIROAKI (JP)
TAKAHASHI MASAKI (JP)
Application Number:
PCT/JP2023/043680
Publication Date:
June 13, 2024
Filing Date:
December 06, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
B32B15/08; H05K1/03
Domestic Patent References:
WO2020144861A12020-07-16
WO2022059711A12022-03-24
WO2022059716A12022-03-24
Foreign References:
JP2006015727A2006-01-19
JP2010248520A2010-11-04
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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