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Title:
METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/122586
Kind Code:
A1
Abstract:
Provided is a metal-clad laminated board, for example, that can reduce variations in the amount of warpage of a semiconductor package, and that has small variations in dimension change rate. Specifically, the metal-clad laminated board comprises a metal foil and one or more sheets of cured prepreg, wherein an average thickness measured according to the following method using a laser displacement gauge is 400 μm or more, and an average value of the absolute values of the difference between a maximum thickness value and a minimum thickness value is 20 μm or less. (Method for measuring the thickness of the metal-clad laminated board) The measurement of the thickness is performed by cutting out four measurement substrates of 60 mm in length × 60 mm in width in a plane direction from an arbitrary location of the metal-clad laminated board. The measurement is performed at 1 mm intervals in the longitudinal direction starting from a point less than 1 mm (but not 0 mm) from an upper side. Measurement of a longitudinal line is performed for 12 lines. The first line is at a position 2.5 mm away from a left side, and subsequently a measurement line is provided every 5 mm. In addition, thickness measurement is performed at 1 mm intervals laterally, starting from a point less than 1 mm (but not 0 mm) from the left side. Measurement of horizontal lines is also performed for 12 lines. The first line is at a position 2.5 mm away from the upper side, and subsequently a measurement line is provided every 5 mm. Particulars are as described in the specification.

Inventors:
NAKANISHI KOTA (JP)
KITAJIMA TAKAYO (JP)
TONOUCHI SHUNSUKE (JP)
MAGOTA SEIYA (JP)
FUJITA HIROAKI (JP)
TAKAHASHI MASAKI (JP)
Application Number:
PCT/JP2023/043681
Publication Date:
June 13, 2024
Filing Date:
December 06, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
B32B15/08; H05K1/03
Domestic Patent References:
WO2020144861A12020-07-16
WO2022059716A12022-03-24
WO2022254587A12022-12-08
WO2022059711A12022-03-24
Foreign References:
JPH09227699A1997-09-02
JPH0994915A1997-04-08
JP2009166404A2009-07-30
CN104830059A2015-08-12
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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