METAL-CLAD LAYERED PLATE PRODUCTION METHOD, METAL-CLAD LAYERED PLATE, PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CORELESS BASE BOARD FORMING SUPPORT AND SEMICONDUCTOR RE-WIRING LAYER FORMING SUPPORT

WIPO Patent Application WO/2020/144861

A1

Provided are a metal-clad layered plate having excellent plate thickness accuracy and a production method therefor. In addition, provided are a printed circuit board yielded by forming a circuit on the metal-clad layered plate, and a semiconductor package yielded by mounting a semiconductor element on the printed circuit board. In addition, provided are a coreless baseboard forming support including the metal-clad layered plate, and a semiconductor re-wiring layer forming support. The metal-clad layered plate production method specifically comprises: (1) a step of grinding at least one of the surfaces of a cured product from a prepreg containing a thermosetting resin composition and a base material; and (2-1) a step of layering, on the surface that has been ground in the step (1), a metallic foil to form a metal-clad layered plate, or (2-2) a step of layering, on the surface that has been ground in the step (1), a metallic foil and a thermosetting resin film or a metallic foil-attached thermosetting resin film, in such a manner that the thermosetting resin film is on the ground surface side, to form the metal-clad layered plate.

KITAJIMA TAKAYO (JP)
OSE MASAHISA (JP)
FUJITA HIROAKI (JP)

PCT/JP2019/000741

July 16, 2020

January 11, 2019

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HITACHI CHEMICAL CO LTD (JP)

B32B15/08; B32B5/28; B32B38/18; H05K3/00

JPH1134221A	1999-02-09
JPH04279081A	1992-10-05
JPH05320382A	1993-12-03

HIRASAWA, Kenichi et al. (JP)

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