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Patent Searching and Data


Title:
METAL FOIL WITH CARRIER AND USE METHOD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/235537
Kind Code:
A1
Abstract:
Provided is a metal foil with a carrier with which rough circuit exposure and fine circuit exposure can both be carried out on the basis of the same alignment mark during wiring formation, and as a result thereof, a rough circuit and a fine circuit can be formed simultaneously in a single-stage circuit formation process. The metal foil with a carrier comprises: a carrier; a release layer provided on at least one surface of the carrier; and a metal layer provided on the release layer. The metal foil with a carrier also includes: a wiring region in which the carrier, the release layer, and the metal layer are present across the entire wiring region; and at least two positioning regions that are provided to the at least one surface of the metal foil with a carrier, and that form alignment marks used for positioning during wiring formation accompanied by exposure and development.

Inventors:
MATSUURA YOSHINORI (JP)
NAKAMURA TOSHIMI (JP)
Application Number:
PCT/JP2020/019685
Publication Date:
November 26, 2020
Filing Date:
May 18, 2020
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H01L23/12; B32B15/04; H05K3/00
Domestic Patent References:
WO1997050121A11997-12-31
Foreign References:
JP2011119501A2011-06-16
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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