METAL MEMBER, METAL MEMBER SURFACE PROCESSING METHOD, SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND COMPOSITE MOLDED BODY

WIPO Patent Application WO/2015/087482

A1

The purpose of the present invention is to form, by means of an energy beam having an energy density lower than conventional energy beams, a rough surface that ensures adhesion between a metal member and other members, or a rough surface capable of suppressing spreading of a solder on the metal member. Disclosed is a method for processing a surface of a metal member (2) that has a metal thin film (22) provided on a surface (21a) of a base material (21). The method has a step for roughening the surface of the metal thin film by: melting or evaporating a surface portion of the metal thin film by irradiating a surface (22a) of the metal thin film with a pulse oscillation laser beam with a pulse width equal to or less than 1 microsecond, said pulse oscillation laser beam having an energy density equal to or less than 100 J/cm2; and coagulating the surface portion of the metal thin film after the melting or evaporation. The metal thin film is configured from a material having, as a main component, at least one element selected from the group consisting of Ni, Au, Pd and Ag.

KOBAYASHI WATARU (JP)
HAYASHI EIJI (JP)
KOUDA KAZUKI (JP)

PCT/JP2014/005625

June 18, 2015

November 10, 2014

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DENSO CORP (JP)

B23K26/00; B23K26/359; H01L21/50; H01L21/52

JP2006303216A	2006-11-02
JP2009255141A	2009-11-05
JP2011238860A	2011-11-24
JP2012233541A	2012-11-29

KIN, Junhi (JP)
Gold Junki (JP)

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