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Patent Searching and Data


Title:
(METH)ACRYLATE RESIN AND CURABLE RESIN COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2018/181647
Kind Code:
A1
Abstract:
Provided are: a (meth)acrylate resin which exhibits high bonding strength if base materials are bonded with each other by means of this (meth)acrylate resin; and a curable resin composition which contains this (meth)acrylate resin. A (meth)acrylate resin which is obtained by reacting an epoxy resin, a modifying compound and a (meth)acrylic acid, said modifying compound being composed of one or more compounds selected from the group consisting of unsaturated aliphatic carboxylic acids (excluding (meth)acrylic acids), carboxylic acid anhydrides (excluding (meth)acrylic acid anhydrides), alcohols and thiols; and a curable resin composition which contains this (meth)acrylate resin.

Inventors:
USUI TAIKOU (JP)
MIYAZAKI KENSUKE (JP)
SHIRAISHI DAISUKE (JP)
Application Number:
PCT/JP2018/013091
Publication Date:
October 04, 2018
Filing Date:
March 29, 2018
Export Citation:
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Assignee:
KYORITSU CHEMICAL & CO LTD (JP)
International Classes:
C08F299/02; C08G59/14; C08G59/20; G02F1/1339
Foreign References:
JP2012188533A2012-10-04
JPS5116107A1976-02-09
JP2004143119A2004-05-20
JPS4855280A1973-08-03
JPS4531077B1
JP2005187746A2005-07-14
JP2016117887A2016-06-30
JP2013130873A2013-07-04
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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