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Title:
METHOD FOR AFFIXING POLISHING PAD OF DOUBLE-SIDED POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/235050
Kind Code:
A1
Abstract:
The present invention is a method for affixing a polishing pad of a double-sided polishing device, the method including: affixing a lower-surface-plate polishing pad to a lower surface plate, and subsequently mounting a ring-form temporary affixing plate on the polishing pad so as to pass through the radial-direction center part of the lower surface plate; positioning an affixing surface of an upper-surface-plate polishing pad on the temporary affixing plate so as to face an upper surface plate, imparting a load to a double-sided polishing machine, and pressure-bonding the temporary affixing plate at only a portion of the temporary affixing plate that is sandwiched by the upper and lower surface plates; forming a ring-form affixing part at the radial-direction center portion of the upper-surface-plate polishing pad and the lower-surface-plate polishing pad, and subsequently removing the temporary affixing plate; positioning the pressure-bonded part of a polishing pad affixing device at the affixing part and sandwiching the pressure-bonded part between the upper and lower surface plates; and moving the pressure-bonding part in the radial direction from the affixing part at the same time as in a vertical direction to thereby pressure-bond the upper-surface-plate polishing pad and the lower-surface-plate polishing pad to the upper and lower surface plates, respectively, while eliminating air between the upper surface plate and the upper-surface-plate polishing pad as well as between the lower surface plate and the lower-surface-plate polishing pad. There is thereby provided a method for affixing a polishing pad of a double-sided polishing device in which pressure-bonding and elimination of air can be performed simultaneously and accurate affixing can be performed.

Inventors:
HISATOMI Shosei (JP)
SASAKI Takuya (JP)
Application Number:
PCT/JP2021/009442
Publication Date:
November 25, 2021
Filing Date:
March 10, 2021
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO., LTD. (JP)
International Classes:
B24B37/12; B24B37/20; H01L21/304
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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