METHOD AND APPARATUS FOR CUTTING CERAMIC

WIPO Patent Application WO/2022/108234

A1

The present invention relates to a method and apparatus for cutting a ceramic, the apparatus comprising: a beam-emitting part for emitting a beam of a wavelength that is absorbed by the ceramic; a damage generation part for generating minute damage at a cutting start part on a cutting path on the periphery of the ceramic; and a control part for controlling the operation of the beam-emitting part and controlling the output, shape, mode, irradiation area, and cutting speed of the beam emitted by the beam-emitting part, wherein the ceramic is locally heated to at most the melting point of the ceramic with a beam, having a beam mode and a beam shape set on the basis of the ceramic material and the thickness or reinforced depth of the ceramic, by controlling the cutting speed in proportion to the beam output, thermal stress and areas affected by heat are controlled to prevent the ceramic from being cut in an arbitrary direction, and thermal stress equal to or greater than the maximum heat resistance strength of the ceramic is generated to cut the ceramic along a desired path.

WO/2013/082107	METHOD FOR LOW ENERGY SEPARATION OF A GLASS RIBBON
WO/2008/080182	METHOD AND DEVICE FOR THE PRODUCTION OF A DIVIDING GAP IN A GLASS PANE
JP2015171955	METHOD FOR MANUFACTURING CURVED PLATE

LEE SEAK JOON (KR)

PCT/KR2021/016399

May 27, 2022

November 11, 2021

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ITI CO LTD (KR)

C03B33/09; B23K26/062; B23K26/38; B23K37/00; B28D1/22; C03B33/037

KR20190083459A	2019-07-12
KR20150111821A	2015-10-06
KR20170043587A	2017-04-21
KR20160059837A	2016-05-27
JP2018506489A	2018-03-08
KR102241518B1	2021-04-19
KR101119289B1	2012-03-15
JP2013112532A	2013-06-10

WELL PATENT LAW FIRM (KR)

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