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Title:
METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL
Document Type and Number:
WIPO Patent Application WO2004078411
Kind Code:
A3
Abstract:
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.

Inventors:
TSAI STAN (US)
LIU FEN Q (US)
WANG YAN (US)
MAVLIEV RASHID (US)
CHEN LIANG-YUH (US)
DUBOUST ALAIN (US)
Application Number:
PCT/US2004/006385
Publication Date:
July 21, 2005
Filing Date:
March 03, 2004
Export Citation:
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Assignee:
APPLIED MATERIALS INC (US)
TSAI STAN (US)
LIU FEN Q (US)
WANG YAN (US)
MAVLIEV RASHID (US)
CHEN LIANG-YUH (US)
DUBOUST ALAIN (US)
International Classes:
B23H5/06; B23H5/08; B24B37/04; B24B49/10; C25D5/02; C25D5/22; C25D7/12; C25D17/00; C25D17/10; C25D21/12; C25F3/16; C25F3/30; C25F7/00; H01L21/321; (IPC1-7): C25F3/16; B23H5/06; B23H5/08; B24B37/04; B24B49/10; C25D5/02; C25D5/22; C25D7/12
Domestic Patent References:
WO2004024394A12004-03-25
Foreign References:
US20040023610A12004-02-05
US6051116A2000-04-18
EP1103346A22001-05-30
US5766446A1998-06-16
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