METHOD, APPARATUS AND SYSTEM FOR DETECTING SPECTRUM END POINT IN CHEMO-MECHANICAL POLISHING, AND COMPUTER-READABLE STORAGE MEDIUM

WIPO Patent Application WO/2019/051998

A1

Disclosed are a method, apparatus and system for detecting a spectrum end point in chemo-mechanical polishing. The method comprises: according to spectrum detection data of a polished thin film on a surface of a wafer, determining smooth spectrum detection data of the polished thin film; according to associated reflectivity data and detection wavelength data in the smooth spectrum detection data, determining extreme points in the smooth spectrum detection data and a wavelength value corresponding to each extreme point; according to the wavelength values of at least two adjacent extreme points and the optical refractive index of the polished thin film, determining the remaining thickness of the polished thin film; and when it is detected that the thickness of the polished thin film reaches a set thickness threshold value, determining that the thickness of the polished thin film is a polishing end point so that a chemo-mechanical polishing device stops polishing at the polishing end point. By means of the detection method, the detection accuracy of the spectrum end point is improved, and the work efficiency of the chemo-mechanical polishing device is improved.

WANG DONGHUI (CN)
JING HAISHI (CN)
LIU BIN (CN)
ZHANG WEIQIANG (CN)
WANG JIAQI (CN)

PCT/CN2017/111916

March 21, 2019

November 20, 2017

Click for automatic bibliography generation  

BEIJING SEMICONDUCTOR EQUIPMENT INSTITUTE THE 45TH RES INSTITUTE OF CETC (CN)

B24B37/00; B24B49/12

CN104117903A	2014-10-29
CN1726116A	2006-01-25
US20010052987A1	2001-12-20
US20020115380A1	2002-08-22
CN102884613A	2013-01-16

CHOFN INTELLECTUAL PROPERTY (CN)

View/Download PDF      PDF Help

Previous Patent: POWER ADAPTER WITH USB DATA READING AND WRITING FUNCTION

Next Patent: TIRE PRESSURE SENSOR AND TIRE PRESSURE DATA QUERY METHOD