Title:
METHOD OF APPLYING A SEMI-RIGID FILM TO A SUBSTRATE
Document Type and Number:
WIPO Patent Application WO2002000419
Kind Code:
A3
Abstract:
A method of adhesively bonding an adhesive coated, semi-rigid film (80) to a substrate (32) is reported. The method utilizes at least two alignment tools (10) that are each positioned to substantially contact the surface of a substrate at an outer edge of the substrate. The adhesive-coated, semi-rigid film (80) is then interposed between the first and the second alignment tools (10) and the adhesive (84) is brought into contact with the major surface of the substrate (32). The semi-rigid film (80) is then aligned by contacting a first side edge of the semi-rigid film with a major surface of a first alignment tool and contacting a second side edge of the semi-rigid film with a major surface of a second alignment tool such that the film is aligned relative to the edge of the substrate. After alignment, pressure is applied to at least a portion of the surface area of the first side of the semi-rigid film to effectuate adhesive bonding of the film to the major surface of the substrate (32). Optionally, an application fluid may be provided between the adhesive layer (84) the semi-rigid film (80) to aid in positioning of the semi-rigid film.
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Inventors:
JANSSEN JEFFREY R
SHEFFIELD WILLIAM F
STUCCI GARY M
SHEFFIELD WILLIAM F
STUCCI GARY M
Application Number:
PCT/US2001/019521
Publication Date:
May 23, 2002
Filing Date:
June 19, 2001
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO (US)
International Classes:
B29C63/00; B29C65/48; E06B5/00; B32B17/10; C03C17/28; C09J5/00; C09J7/02; B29L9/00; (IPC1-7): B29C63/02
Domestic Patent References:
| WO2000024576A1 | 2000-05-04 |
Foreign References:
| EP0884205A2 | 1998-12-16 | |||
| US4708759A | 1987-11-24 | |||
| US4637850A | 1987-01-20 | |||
| EP0836933A2 | 1998-04-22 |
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