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Patent Searching and Data


Title:
METHOD FOR BONDING SYNTHETIC RESIN
Document Type and Number:
WIPO Patent Application WO/2013/042377
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a novel method for bonding a synthetic resin without the use of an bonding agent or thermal fusion. A synthetic resin material (including silicone-based resins, such as silicone, silicone rubber or silicone resin and plastic materials in general, such as polyethylene, acrylic, polystyrene, polypropylene, polyurethane, polyvinyl alcohol, and cyclic polyolefin materials) is bonded by placing one over another the bonding surface of each of the materials after the surface has been subjected to excitation treatment. Excitation treatment of the bonding surface can be accomplished by exposure to O2 plasma, exposure to atmospheric pressure plasma, or exposure to vacuum UV light.

Inventors:
YAMAMOTO TAKATOKI (JP)
Application Number:
PCT/JP2012/006014
Publication Date:
March 28, 2013
Filing Date:
September 21, 2012
Export Citation:
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Assignee:
TOKYO INST TECH (JP)
International Classes:
B29C65/00; B29B13/08
Foreign References:
JP2009220477A2009-10-01
JP2009173894A2009-08-06
JP2008019348A2008-01-31
Attorney, Agent or Firm:
MAYAMA INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation M eye Py (JP)
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