Title:
METHOD FOR CLEANING OPTICAL FILM THICKNESS MEASUREMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/137653
Kind Code:
A1
Abstract:
The present invention relates to a method for cleaning an optical film thickness measurement system that is used for measuring the film thickness of a substrate such as a wafer while the substrate is being polished. This method comprises: supplying a rinsing liquid to a through hole (51) formed in a polishing pad (2) on a polishing table (3) before or after polishing a substrate (W) using a slurry; cleaning an optical sensor head (7) disposed below the through hole (51) using the rinsing liquid; and discharging the rinsing liquid from the through hole (51) via a drain line (54).
Inventors:
WEN ZHONGXIN (JP)
TAKAHASHI NOBUYUKI (JP)
MARUYAMA TORU (JP)
YOKOYAMA TAICHI (JP)
TAKAHASHI NOBUYUKI (JP)
MARUYAMA TORU (JP)
YOKOYAMA TAICHI (JP)
Application Number:
PCT/JP2019/049154
Publication Date:
July 02, 2020
Filing Date:
December 16, 2019
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/013; B08B3/02; B24B49/12; B24B55/06; H01L21/304
Foreign References:
| JP2006525878A | 2006-11-16 | |||
| JP2001088021A | 2001-04-03 | |||
| JP2005057100A | 2005-03-03 | |||
| JP2018075650A | 2018-05-17 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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