METHOD FOR CONTROLLING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION

WIPO Patent Application WO/2018/143014

A1

The present invention pertains to a method for manufacturing an electronic component having an electromagnetic shield, wherein the method is provided with: an affixing step for affixing a temporary protection material to a workpiece having concavo-convex features on the surface; a light-curing step for curing the temporary protection material by light irradiation; a dicing step for dicing the workpiece and the temporary protection material; a shield step for forming a metal film on the portion of the diced workpiece to which the temporary protection material is not affixed; and a separation step for separating the temporary protection material and the workpiece on which the metal film has been formed. The temporary protection material is formed from a resin composition for temporary protection having an elasticity at 25°C of 3 MPa or below, and an elasticity at 25°C of 40 MPa or above after light irradiation at an exposure amount of 500 mJ/cm2 or above.

JP2014060429	WAFER BONDING DEVICE AND WAFER BONDING METHOD
JPH05275429	METHOD OF FORMING INTRINSIC GETTERING SITES IN BONDED SUBSTRATE, AND METHOD OF CAPTURING MOVABLE IONS IN SILICON SEMICONDUCTOR SUBSTRATE
WO/2009/108446	MEMORY DEVICE WITH LOCAL DATA LINES AND METHOD OF MAKING AND OPERATING THE SAME

YAMAGUCHI YUSHI (JP)
FURUTANI RYOJI (JP)
IKEYA TAKUJI (JP)
SOBUE SHOGO (JP)
OOYAMA YASUYUKI (JP)

PCT/JP2018/001967

August 09, 2018

January 23, 2018

Click for automatic bibliography generation  

HITACHI CHEMICAL CO LTD (JP)

H01L21/02; C08J5/18; C08L33/00; H01L21/301; H01L23/00; H05K9/00

JP2014183180A	2014-09-29
JP2006294685A	2006-10-26
JP2017208529A	2017-11-24
JP2018006462A	2018-01-11
JP2017054891A	2017-03-16

HASEGAWA Yoshiki et al. (JP)

View/Download PDF      PDF Help

Previous Patent: POWER DISTRIBUTION SYSTEM IN MOVING BODY

Next Patent: TACTILE-SENSATION PRESENTATION DEVICE