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Title:
METHOD FOR CUTTING POLYCRYSTALLINE SILICON ROD, METHOD FOR MANUFACTURING CUT ROD OF POLYCRYSTALLINE SILICON ROD, METHOD FOR MANUFACTURING NUGGET OF POLYCRYSTALLINE SILICON ROD, AND POLYCRYSTALLINE SILICON ROD CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/246152
Kind Code:
A1
Abstract:
The present invention realizes a method which prevents metal contamination when cutting a polycrystalline silicon rod. The present invention pertains to a method, for cutting a polycrystalline silicon rod (S), that includes a cutting step for cutting the polycrystalline silicon rod (S) via a cutting tool (133), wherein, during the cutting step, a liquid (L1) is supplied from a first nozzle (14) to a cutting position of the polycrystalline silicon rod (S), and a liquid (L2) is supplied from a second nozzle (15) to a surface of the polycrystalline silicon rod (S).

Inventors:
SAKAI JUNYA (JP)
TASAKI HIROYUKI (JP)
Application Number:
PCT/JP2020/016832
Publication Date:
December 10, 2020
Filing Date:
April 17, 2020
Export Citation:
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Assignee:
TOKUYAMA CORP (JP)
International Classes:
B28D7/02; B24B27/06; B24B55/02; B24B55/06; B28D5/02
Domestic Patent References:
WO2017002670A12017-01-05
Foreign References:
JPH0747542A1995-02-21
JPS50119379A1975-09-18
JP2007281210A2007-10-25
JPS501311Y11975-01-14
JP2002028921A2002-01-29
JPH09255467A1997-09-30
JP2002097096A2002-04-02
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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