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Patent Searching and Data


Title:
METHOD FOR CUTTING SILICON ROD AND DIAMOND MULTI-WIRE CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/013238
Kind Code:
A1
Abstract:
Disclosed is a method for cutting a silicon rod, comprising: adjusting, during a cutting process, the wire-supply amount and/or feed rate of new wire at different positions of a crystal cross-section, or using a cooling tube (4) to supply cutting fluid to diamond wires and using all the diamond wires to cut a silicon rod (3). A distance between the supply position of the cutting fluid and the edge of the silicon rod is 10-20 mm. Also disclosed is a diamond multi-wire cutting device. The method for cutting silicon rods ensures that the silicon wafers obtained by cutting are of high quality.

Inventors:
ZHENG JIAZHEN (CN)
LOW KIN PENG (CN)
GAO HAITANG (CN)
Application Number:
PCT/CN2020/104070
Publication Date:
January 28, 2021
Filing Date:
July 24, 2020
Export Citation:
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Assignee:
XUZHOU XINJING SEMICONDUCTOR TECH CO LTD (CN)
International Classes:
B28D5/04; B28D5/00; B28D7/02
Foreign References:
CN110370480A2019-10-25
CN110466085A2019-11-19
CN110370477A2019-10-25
CN210732873U2020-06-12
CN203391130U2014-01-15
CN101979230A2011-02-23
CN207373492U2018-05-18
CN106938503A2017-07-11
JPH0985736A1997-03-31
EP0798091A21997-10-01
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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