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Patent Searching and Data


Title:
METHOD FOR CUTTING SILICON ROD
Document Type and Number:
WIPO Patent Application WO/2021/180247
Kind Code:
A1
Abstract:
A method for cutting a silicon rod, in which a silicon rod is cut into silicon wafers, and comprising a slicing step. The silicon rod is a single crystal silicon rod having a crystal orientation of 100, the slicing direction forms an angle other than 90 degrees with the axis of the silicon rod, and the silicon wafers obtained from the slicing are single crystal silicon wafers having a non-100 crystal orientation. The method adjusts the slicing direction of a semi-rectangular rod or a rectangular rod, and is able to cut first single crystal silicon wafers having a non-100 crystal orientation from single crystal silicon rods. The method is further able to cut second single crystal silicon wafers having a non-100 crystal orientation from edge material, and is thus able to improve the rate of utilization of single crystal silicon rods.

Inventors:
FU LIMING (CN)
MENG XIANGXI (CN)
CAO YUHONG (CN)
Application Number:
PCT/CN2021/086423
Publication Date:
September 16, 2021
Filing Date:
April 12, 2021
Export Citation:
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Assignee:
CHANGZHOU SHICHUANG ENERGY CO LTD (CN)
International Classes:
B28D5/00
Foreign References:
CN111251483A2020-06-09
US6159285A2000-12-12
CN201824485U2011-05-11
CN110712308A2020-01-21
US8623137B12014-01-07
JPS63301525A1988-12-08
CN108068221A2018-05-25
CN202862430U2013-04-10
CN103552166A2014-02-05
Attorney, Agent or Firm:
SUZHOU MAMBO PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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