METHOD AND DEVICE FOR ADJUSTING SUCTION OF CUTTING MACHINE

Title:

METHOD AND DEVICE FOR ADJUSTING SUCTION OF CUTTING MACHINE

Document Type and Number:

WIPO Patent Application WO/2005/072920

Kind Code:

A1

Abstract:

A method and a device for adjusting the suction of a cutting machine capable of cutting even an elastic sheet material in a properly compressed state by suppressing the variation of compression on the sheet material. The set value of a suction pressure is set such that the absolute value of the suction pressure, which is a negative pressure lower than the atmospheric pressure, becomes larger as the numerical value thereof becomes larger. For one-piece cutting as shown in Fig. 1B, the set value of the suction pressure is increased since the cutting distance of an already cut portion is increased as the cutting is advanced. For stacked cutting as shown in Fig. 1A, though the set value of the suction pressure is increased before parts (1a), (1b), (1c), (1d), (1e), and (1f) are cut, when the cutting is moved from the part (1f) to the part (1g), the cutting distance of the already cut portion where air leaks is reduced since the parts (1a), (1b), and (1c) are covered by a sealing sheet, and the set value of the suction pressure is lowered.

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Inventors:

MORITA TOSHIAKI (JP)

Application Number:

PCT/JP2005/001011

Publication Date:

August 11, 2005

Filing Date:

January 26, 2005

Export Citation:

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Assignee:

SHIMA SEIKI MFG (JP)
MORITA TOSHIAKI (JP)

International Classes:

B26D5/00; B26D7/02; B26D7/01; (IPC1-7): B26D7/02

Foreign References:

JPS6052299A	1985-03-25
JPS60155336A	1985-08-15
JPS6052299A	1985-03-25
JPH07205091A	1995-08-08
JPH09155794A	1997-06-17
JPH0551865A	1993-03-02
JPH0551865A	1993-03-02

Other References: