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Patent Searching and Data


Title:
METHOD AND DEVICE FOR FORMING HOLES IN GLASS PLATE
Document Type and Number:
WIPO Patent Application WO/2004/002704
Kind Code:
A1
Abstract:
A glass plate hole forming device (1) comprises a recess forming means (8) that, in a recess forming area (2), forms a recess (5) in the upper surface (4) of a glass plate (3) and that forms a recess (6) in the lower surface (7) of the glass plate (3) that communicates with the recess (5), a chamfering means (10) that, in a chamfering area (9) adjacent the recess forming area (2), applies fine chamfering to the edges (12, 13) of the openings in recesses (5, 6) formed in the glass plate (3) by the recess forming means (8), and a transfer means (11) that successively transfers glass plates (3) to be formed with recesses (5, 6) to the recess forming area (2) and that successively transfers the glass plates (3) formed with the recesses (5, 6) to a chamfering section (9).

Inventors:
BANDO KAZUAKI (JP)
Application Number:
PCT/JP2003/006759
Publication Date:
January 08, 2004
Filing Date:
May 29, 2003
Export Citation:
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Assignee:
BANDO KIKO CO (JP)
BANDO KAZUAKI (JP)
International Classes:
B23B35/00; B23B39/22; B28D1/14; B24B9/08; B24B19/00; B65G49/06; C03B33/02; (IPC1-7): B28D1/14
Foreign References:
JP2001071323A2001-03-21
JPH11149669A1999-06-02
JP2000311616A2000-11-07
JP2000127013A2000-05-09
JPH11349354A1999-12-21
Other References:
See also references of EP 1518651A4
Attorney, Agent or Firm:
Takada, Takeshi (Hanabusa Building 12-6, Minamiaoyama 5-chom, Minato-ku Tokyo, JP)
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