Title:
METHOD AND DEVICE FOR WET PROCESSING INTEGRATED CIRCUIT SUBSTRATES USING A MIXTURE OF CHEMICAL STEAM VAPORS AND CHEMICAL GASES
Document Type and Number:
WIPO Patent Application WO/2021/098038
Kind Code:
A1
Abstract:
Method and device for wet processing integrated circuit（IC）substrates using a fresh mixture of chemical steam vapors and chemical gases may include loading the substrates into an enclosed processing chamber with a 90°rotatable middle section (401); closing the processing chamber (402); conditioning the processing chamber with preset temperature nitrogen gas (403); injecting a fresh mixture of chemical gas and chemical steam into the processing chamber sequentially to condense wet processing fresh chemicals on site (404); circulating the mixture of chemical steam vapors and rotating at least one magnetic rod within the processing chamber to treat the substrates uniformly (405); performing a deionized water rinse of the substrates and turning on the adjustable multi-modulated megasonic energy when necessary (406); injecting solvent isopropyl alcohol steam vapor into the processing chamber for the Marangoni drying (408); completely drying the substrates in the processing chamber with hot nitrogen gas (409); and unloading the treated substrates (410)．
Inventors:
NI DANGSHENG (CN)
Application Number:
PCT/CN2020/072396
Publication Date:
May 27, 2021
Filing Date:
January 16, 2020
Export Citation:
Assignee:
SHANGHAI SNA ELECTRONIC INFORMATION TECH CO LTD (CN)
International Classes:
H01L21/306; B08B3/00; C23F1/08
Domestic Patent References:
| WO2019241060A1 | 2019-12-19 |
Foreign References:
| CN101924031A | 2010-12-22 | |||
| JP2006026549A | 2006-02-02 | |||
| US6598805B2 | 2003-07-29 | |||
| CN108971078A | 2018-12-11 | |||
| US6332470B1 | 2001-12-25 | |||
| US20070261716A1 | 2007-11-15 | |||
| US20140041694A1 | 2014-02-13 |
Attorney, Agent or Firm:
SHANGHAI ZHI XIN PATENT AGENT LTD. (CN)
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