Title:
METHOD FOR DIVIDING COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/009960
Kind Code:
A1
Abstract:
[Problem] To provide a method for dividing a composite material, said method causing no cracks in end surfaces of a brittle material layer and causing no deterioration in the quality of end parts of a resin layer. [Solution] The present invention is a method for dividing a composite material 10 wherein a brittle material layer 1 and a resin layer 2 are superposed upon each other, said method being characterized by comprising: a resin removal step wherein the resin layer is irradiated with laser light L1 oscillated from a first laser light source 20a along a planned dividing line DL of the composite material, thereby forming a processing groove 25 that extends along the planned dividing line; a brittle material removal step wherein the brittle material layer is irradiated with laser light L2 oscillated from an ultrashort pulse laser light source 30 along the planned dividing line after the resin removal step, thereby forming a processing mark 11 that extends along the planned dividing line; and a brittle material layer dividing step wherein a thermal stress is generated in the brittle material layer by irradiating a surface of the brittle material layer, said surface being on the reverse side from the resin layer, with laser light L3 oscillated from a second laser light source 20b after the brittle material layer removal step, thereby dividing the brittle material layer.
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Inventors:
KANNO TOSHIHIRO (JP)
HIRATA SATOSHI (JP)
NAKAI KOTA (JP)
MATSUO NAOYUKI (JP)
HIRATA SATOSHI (JP)
NAKAI KOTA (JP)
MATSUO NAOYUKI (JP)
Application Number:
PCT/JP2020/006411
Publication Date:
January 21, 2021
Filing Date:
February 19, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B26F3/00; B23K26/364; B26F3/06; B28D5/00; C03B33/033; C03B33/07; C03B33/09
Domestic Patent References:
| WO2013175767A1 | 2013-11-28 |
Foreign References:
| JP2017145188A | 2017-08-24 | |||
| JP2018519229A | 2018-07-19 | |||
| JP2011178636A | 2011-09-15 | |||
| US20060275989A1 | 2006-12-07 | |||
| JP2018170474A | 2018-11-01 | |||
| JPH10506087A | 1998-06-16 | |||
| JP2018170475A | 2018-11-01 | |||
| JP2011178636A | 2011-09-15 | |||
| JPS6239461B2 | 1987-08-24 | |||
| JP2012073580A | 2012-04-12 |
Other References:
JOHN LOPEZ ET AL.: "GLASS CUTTING USING ULTRASHORT PULSED BESSEL BEAMS", INTERNATIONAL CONGRESS ON APPLICATIONS OF LASERS & ELECTRO-OPTICS (ICALEO, October 2015 (2015-10-01), Retrieved from the Internet
Attorney, Agent or Firm:
MAKOTO INTERNATIONAL PATENT ATTORNEYS OFFICE (JP)
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