METHOD FOR FABRICATING MOLD HAVING RECESSED PATTERN AND METHOD FOR PRODUCING PATTERNED SHEET

Title:

METHOD FOR FABRICATING MOLD HAVING RECESSED PATTERN AND METHOD FOR PRODUCING PATTERNED SHEET

Document Type and Number:

WIPO Patent Application WO/2017/195545

Kind Code:

A1

Abstract:

Provided are: a method for fabricating a recessed-pattern mold with high precision and high productivity; and a method for producing a patterned sheet. This mold fabrication method comprises: a step for preparing an electroformed mold having a raised pattern, and first and second molds for forming a cavity; a step for anchoring the electroformed mold, except for the edge part thereof, to the first mold; a mold clamping step for clamping the electroformed mold, except for the edge and the raised pattern region thereof, between the first mold and the second mold so as to form a cavity; and an injection step for filling the cavity with resin.

Inventors:

OGAWA SHOTARO (JP)
USA TOSHIHIRO (JP)
TAMAKI KENICHIRO (JP)

Application Number:

PCT/JP2017/015652

Publication Date:

November 16, 2017

Filing Date:

April 19, 2017

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

B29C59/02; A61M37/00; B29C33/38

Domestic Patent References:

WO2014077242A1

2014-05-22

Foreign References:

JP2015226649A	2015-12-17
JP2010006010A	2010-01-14
JPH1134120A	1999-02-09
JP2013251301A	2013-12-12
JP2013074924A	2013-04-25

Other References: