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Title:
METHOD FOR FABRICATING RESIN COMPOSITION FOR SEALING SEMICONDUCTORS, AND PULVERIZER
Document Type and Number:
WIPO Patent Application WO/2011/122211
Kind Code:
A1
Abstract:
Disclosed is a pulverizer (1) which is an airflow pulverizer provided with: a pulverizing unit (2) for pulverizing a first composition; a cooling device (3); a high-pressure air generator (4); and a storage unit (5) for storing the pulverized first composition. The pulverizing unit (2) is provided with a chamber (6), an outlet (62) which discharges the pulverised first composition is formed in the base of the chamber (6), and a wall which surrounds the periphery of the outlet (62) is formed near the outlet. A plurality of nozzles (71, 72) are disposed in the side of the chamber (6), and a supply part (73) which communicates with the inside of the nozzle (72) is disposed at the top of the nozzle (72). The pressure of air supplied inside the chamber (6) is set to 0.3 MPa or more, the temperature thereof is set to 20°C or less, and the humidity thereof is set to 40% RH or less.

Inventors:
SUMIYOSHI TAKAFUMI (JP)
SHIBATA HIROSHI (JP)
Application Number:
PCT/JP2011/054696
Publication Date:
October 06, 2011
Filing Date:
March 02, 2011
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
SUMIYOSHI TAKAFUMI (JP)
SHIBATA HIROSHI (JP)
International Classes:
B29B13/10; C08J3/12; C08K3/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2009016133A12009-02-05
WO2007088889A12007-08-09
Foreign References:
JP2006187873A2006-07-20
JP2005281401A2005-10-13
JP2006297701A2006-11-02
JP2000271929A2000-10-03
JPH11246671A1999-09-14
JP2005119197A2005-05-12
Attorney, Agent or Firm:
ASAHI Kazuo et al. (JP)
Morning ratio One husband (JP)
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Claims:



 
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