Title:
METHOD OF FIXING ABRASIVE TO DIAMOND SAW WIRE
Document Type and Number:
WIPO Patent Application WO/2017/107194
Kind Code:
A1
Abstract:
A method of fixing an abrasive to a diamond saw wire is disclosed, and comprises forming an electrically conductive surface layer (21) meltable or photo- or heat-curable on a surface of an abrasive (2), then allowing the abrasive (2) to be uniformly adsorbed on a surface of a wire core (1) by means of electricity or magnetism, then performing heating and fusion welding for a short period of time or photo-(or heat-)curing, so as to allow the abrasive (2) to be temporarily fixed to the wire core (1) with better adhesion, and finally electroplating coating (4) onto the same, such that the abrasive (2) is permanently and completely fixed to the wire core (1) with enhanced adhesion, thereby completing fabrication of the diamond saw wire. By utilizing the described method of fixing an abrasive, detachment of an abrasive can be significantly reduced or even prevented during electroplating a coating, thereby increasing a production speed and enabling fabrication of diamond saw wires having an abrasive with high adhesion, prominent protrusion and a debris-discharging space.
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Inventors:
LEE PING-FENG (CN)
LO WEN-HSIANG (CN)
LEE CHUN-HSIEN (CN)
HSU WEN-SHAN (CN)
LO WEN-HSIANG (CN)
LEE CHUN-HSIEN (CN)
HSU WEN-SHAN (CN)
Application Number:
PCT/CN2015/098948
Publication Date:
June 29, 2017
Filing Date:
December 25, 2015
Export Citation:
Assignee:
LEE PING-FENG (CN)
International Classes:
B23D61/18; B28D5/04
Foreign References:
| CN103192461A | 2013-07-10 | |||
| CN102729343A | 2012-10-17 | |||
| CN101618575A | 2010-01-06 | |||
| CN102528166A | 2012-07-04 | |||
| JP4073328B2 | 2008-04-09 | |||
| JP2009066689A | 2009-04-02 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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