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Patent Searching and Data


Title:
METHOD OF FORMING COMPONENT, AND PLASMA PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/221022
Kind Code:
A1
Abstract:
Provided is a method of forming a component used in a plasma processing device. The method of forming a component comprises a step of, while supplying a raw material of first ceramics and a raw material of second ceramics different from the first ceramics, irradiating the raw material of the first ceramics and the raw material of the second ceramics with an energy beam.

Inventors:
SAITO MICHISHIGE (JP)
NAGASEKI KAZUYA (JP)
KANEKO SHOTA (JP)
Application Number:
PCT/JP2019/018726
Publication Date:
November 21, 2019
Filing Date:
May 10, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; H05H1/46
Domestic Patent References:
WO2016178777A12016-11-10
WO2017066077A12017-04-20
WO2016205729A12016-12-22
Foreign References:
JP2018507327A2018-03-15
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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