Title:
METHOD FOR FORMING CURED FILM
Document Type and Number:
WIPO Patent Application WO/2020/243898
Kind Code:
A1
Abstract:
The present disclosure relates to a method for forming a cured film, wherein the method includes a step of forming a photosensitive layer on a substrate using a photosensitive resin composition containing a carboxy group-containing resin, a photopolymerizable compound having an ethylenically unsaturated group, and a photopolymerization initiator; a step of exposing the photosensitive layer to a predetermined pattern; a step of obtaining a resin pattern by developing and removing the photosensitive layer in an unexposed area with an alkali aqueous solution; and a step of heat-treating the resin pattern at a temperature of 140°C or more to eliminate the carboxy group.
Inventors:
TANIMOTO AKITOSHI (JP)
KATOU SADAAKI (JP)
MURAKAMI YASUHARU (JP)
JIANG XUESONG (CN)
MA XIAO-DONG (CN)
KATOU SADAAKI (JP)
MURAKAMI YASUHARU (JP)
JIANG XUESONG (CN)
MA XIAO-DONG (CN)
Application Number:
PCT/CN2019/089958
Publication Date:
December 10, 2020
Filing Date:
June 04, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
UNIV SHANGHAI JIAOTONG (CN)
UNIV SHANGHAI JIAOTONG (CN)
International Classes:
G03F7/004; C08L33/02
Domestic Patent References:
| WO2001022165A1 | 2001-03-29 |
Foreign References:
| US20100160474A1 | 2010-06-24 | |||
| US20100160474A1 | 2010-06-24 | |||
| CN101410421A | 2009-04-15 | |||
| CN102859437A | 2013-01-02 |
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (CN)
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