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Patent Searching and Data


Title:
METHOD FOR FORMING CURED FILM
Document Type and Number:
WIPO Patent Application WO/2020/243898
Kind Code:
A1
Abstract:
The present disclosure relates to a method for forming a cured film, wherein the method includes a step of forming a photosensitive layer on a substrate using a photosensitive resin composition containing a carboxy group-containing resin, a photopolymerizable compound having an ethylenically unsaturated group, and a photopolymerization initiator; a step of exposing the photosensitive layer to a predetermined pattern; a step of obtaining a resin pattern by developing and removing the photosensitive layer in an unexposed area with an alkali aqueous solution; and a step of heat-treating the resin pattern at a temperature of 140°C or more to eliminate the carboxy group.

Inventors:
TANIMOTO AKITOSHI (JP)
KATOU SADAAKI (JP)
MURAKAMI YASUHARU (JP)
JIANG XUESONG (CN)
MA XIAO-DONG (CN)
Application Number:
PCT/CN2019/089958
Publication Date:
December 10, 2020
Filing Date:
June 04, 2019
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
UNIV SHANGHAI JIAOTONG (CN)
International Classes:
G03F7/004; C08L33/02
Domestic Patent References:
WO2001022165A12001-03-29
Foreign References:
US20100160474A12010-06-24
US20100160474A12010-06-24
CN101410421A2009-04-15
CN102859437A2013-01-02
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (CN)
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