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Title:
METHOD FOR LIMITING DIVOT FORMATION IN POST SHALLOW TRENCH ISOLATION PROCESSES
Document Type and Number:
WIPO Patent Application WO2003044833
Kind Code:
A3
Abstract:
A method for limiting divot (305) formation in shallow trench isolation structures. The method includes: providing a trench (285) formed in a silicon region (260) with a deposited oxide (290); oxidizing a top layer of the silicon region (260) to form a layer of thermal oxide (302) on top of the silicon region (260); and selectively etching the thermal oxide (302) with respect to the deposited oxide (290).

Inventors:
BARTLAU PETER H
CANTELL MARC W
LASKEY JEROME B
WEIL JAMES D
Application Number:
PCT/US2002/036397
Publication Date:
November 27, 2003
Filing Date:
November 14, 2002
Export Citation:
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Assignee:
IBM (US)
International Classes:
H01L21/28; H01L21/302; H01L21/308; H01L21/316; H01L21/76; H01L21/762; H01L21/8238; H01L27/08; H01L27/092; H01L29/423; H01L29/49; H01L29/78; (IPC1-7): H01L21/76
Foreign References:
US6051478A2000-04-18
US6197659B12001-03-06
US5447884A1995-09-05
US6271094B12001-08-07
US20020028555A12002-03-07
US6335261B12002-01-01
US6251746B12001-06-26
US6248641B12001-06-19
US6180493B12001-01-30
US6165871A2000-12-26
US6027982A2000-02-22
US5998278A1999-12-07
Other References:
See also references of EP 1464074A4
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