Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MANUFACTURING ASSEMBLY SUBSTRATE, AND ASSEMBLY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/205685
Kind Code:
A1
Abstract:
Provided are an assembly substrate and a method for manufacturing an assembly substrate, whereby the alignment precision of a device unit can be increased. The method for manufacturing an assembly substrate 100 comprises: a step S302 in which a first mark A1 is formed on a first substrate 330; a step S304 in which an upper surface of the first substrate 330 and a lower surface of a second substrate 350 are bonded; a step S305 in which an opening OP is formed in the second substrate 350 such that the first mark A1 is exposed; and a step S306 in which a device unit DP is formed on an upper surface of the second substrate 350 based on the first mark A1.

Inventors:
FUKUMITSU, Masakazu (JP)
KAMOTO, Taku (JP)
Application Number:
PCT/JP2020/042115
Publication Date:
October 14, 2021
Filing Date:
November 11, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO., LTD. (JP)
International Classes:
H03H3/02; H05K3/00; H03H9/24
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF:



 
Previous Patent: AIR CONDITIONING SYSTEM

Next Patent: MULTILOBE BEARING