Title:
METHOD FOR MANUFACTURING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/270613
Kind Code:
A1
Abstract:
A method for manufacturing a bonded body, having: a pre-bonding step in which a substrate A, a solid bonding agent, and a substrate B are positioned in this order to prepare a layered body, said solid bonding agent having, as the primary component thereof, an amorphous thermoplastic resin that is a thermoplastic epoxy resin and/or a phenoxy resin; and a bonding step in which the layered body is heated and pressurized to melt the solid bonding agent, and the substrate A and the substrate B are bonded, wherein the amorphous thermoplastic resin has an epoxy equivalent of 1,600 or greater or the amorphous thermoplastic resin does not include an epoxy group, and the heat of fusion of the amorphous thermoplastic resin is 15 J/g or less.
Inventors:
TAKAHASHI NOBUYUKI (JP)
KUROKI KUNIHIRO (JP)
SAITO HAYATO (JP)
KUROKI KUNIHIRO (JP)
SAITO HAYATO (JP)
Application Number:
PCT/JP2022/025232
Publication Date:
December 29, 2022
Filing Date:
June 24, 2022
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
B29C65/48; C09J5/06; C09J163/00; C09J171/12
Domestic Patent References:
| WO2018124215A1 | 2018-07-05 | |||
| WO2011016408A1 | 2011-02-10 |
Foreign References:
| JPH11181349A | 1999-07-06 | |||
| JPH10251613A | 1998-09-22 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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