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Title:
METHOD FOR MANUFACTURING CHIP-MOUNTED SUBSTRATE, AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/084902
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a chip-mounted substrate, the method comprising: preparing a laminate substrate comprising a plurality of chips, a first substrate to which the plurality of chips are bonded temporarily, and a second substrate bonded to the first substrate with the plurality of chips therebetween; and separating from the first substrate the plurality of chips bonded to the first substrate and the second substrate in order to bond the plurality of chips to one surface of a third substrate including a device layer.

Inventors:
TANOUE HAYATO (JP)
MIZOMOTO YASUTAKA (JP)
YAMASHITA YOHEI (JP)
Application Number:
PCT/JP2020/033410
Publication Date:
May 06, 2021
Filing Date:
September 03, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L25/04; H01L21/301; H01L25/18
Domestic Patent References:
WO2018003602A12018-01-04
WO2019098102A12019-05-23
WO2018157937A12018-09-07
Foreign References:
US20190035688A12019-01-31
US20190081200A12019-03-14
JP2004288689A2004-10-14
JPH04340251A1992-11-26
US20190276308A12019-09-12
JP2015046569A2015-03-12
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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