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Title:
METHOD FOR MANUFACTURING CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2015/107568
Kind Code:
A1
Abstract:
A resin mold, comprising a thermosetting resin substrate on which an inverted contact pin pattern is printed and a thermoplastic resin, is used to form a contact pin pattern in the resin mold, after which the thermoplastic resin is dissolved, thereby manufacturing a connector having a structure wherein multiple contact pins are established on the surface of the resin substrate.

Inventors:
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
Application Number:
PCT/JP2014/000255
Publication Date:
July 23, 2015
Filing Date:
January 20, 2014
Export Citation:
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Assignee:
LEAP CO LTD (JP)
International Classes:
B29C69/02; H01R43/16; C25D5/02; C25D7/00; C25D1/00
Domestic Patent References:
WO2013072954A12013-05-23
WO2013072952A12013-05-23
WO2011111639A12011-09-15
Foreign References:
JP2008218285A2008-09-18
JP2006269400A2006-10-05
JP2007141731A2007-06-07
JP2004247216A2004-09-02
Attorney, Agent or Firm:
HAGIHARA, MAKOTO (JP)
Makoto Hagiwara (JP)
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