Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION
Document Type and Number:
WIPO Patent Application WO/2021/251112
Kind Code:
A1
Abstract:
Provided is a method for manufacturing an electronic component having an electromagnetic shield, the manufacturing method comprising: an affixing step in which a temporary protective material is affixed to a body to be processed which has irregularities on a surface thereof; a photo-curing step in which the temporary protective material is cured by irradiation with light; a dicing step in which the body to be processed and the temporary protective material are formed into individual pieces; a shielding step in which a metal film is formed on a portion, of the body to be processed which has been formed into individual pieces, that does not have the temporary protective material affixed thereto; and a detachment step for detaching the temporary protective material and the body to be processed body on which the metal film is formed. The temporary protective material is formed from a resin composition for temporary protection having a shear viscosity at 35ºC of 5000 Pa•S or greater, a modulus of elasticity at 25ºC of 100 MPa or less after irradiation with light with an exposure amount set to 500 mJ/cm2 or higher, and an elongation percentage of 35% or higher in a tensile test.

Inventors:
OGAWA SAEKO (JP)
SOBUE SHOGO (JP)
Application Number:
PCT/JP2021/019465
Publication Date:
December 16, 2021
Filing Date:
May 21, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/00; C08K3/01; C08K5/54; C08L33/04; H01L21/301
Domestic Patent References:
WO2018143014A12018-08-09
Foreign References:
JP2019140201A2019-08-22
JP2019102745A2019-06-24
JP2013074200A2013-04-22
JP2017054891A2017-03-16
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: