Title:
METHOD FOR MANUFACTURING FILM-ATTACHED TRANSPARENT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/151431
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for manufacturing a film-attached transparent substrate, the method being capable of preparing a film-attached transparent substrate having a low light absorptance, in particular, a low visible-light absorptance, even in the case of a film-attached transparent substrate having a metal layer and a dielectric layer. Provided is a method for manufacturing a film-attached transparent substrate, the method being characterized by being provided with: a metal-layer forming step for forming a metal layer 2 on a transparent substrate 1; a protective-metal-layer forming step for forming, on the opposite side of the metal layer 2 with respect to the transparent substrate 1, a protective metal layer 5 in contact with the metal layer 2; and a dielectric-layer forming step for forming, on the opposite side of the protective metal layer 5 with respect to the transparent substrate 1, a dielectric layer 4 in contact with the protective metal layer 5, by means of sputtering.
Inventors:
SAHARA KEIICHI (JP)
IMAMURA TSUTOMU (JP)
TANABE YASUTAKA (JP)
IMAMURA TSUTOMU (JP)
TANABE YASUTAKA (JP)
Application Number:
PCT/JP2019/003468
Publication Date:
August 08, 2019
Filing Date:
January 31, 2019
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
G02B5/08; C03C17/36; C23C14/06; C23C14/08; G02B5/28
Domestic Patent References:
| WO2014129297A1 | 2014-08-28 |
Foreign References:
| JP2006317603A | 2006-11-24 | |||
| JPS62235232A | 1987-10-15 | |||
| JP2000229381A | 2000-08-22 | |||
| JP2011515714A | 2011-05-19 | |||
| JP2016540310A | 2016-12-22 | |||
| DE102016125042A1 | 2017-06-29 |
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