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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING FILTER ON IMAGE SENSOR WAFER
Document Type and Number:
WIPO Patent Application WO/2021/056950
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a filter on an image sensor wafer. The method comprises: providing an image sensor wafer (100), wherein the image sensor wafer (100) comprises a plurality of sensing regions (110) and a non-sensing region (120) between and surrounding these sensing regions (110); forming a patterned sacrificial layer (200) on the non-sensing region (120); forming a filter layer (300) on the entire face of the image sensor wafer, so that a first part (310) of the filter layer (300) covers the patterned sacrificial layer (200), and a second part (320) of the filter layer covers these sensing regions (110); and removing the patterned sacrificial layer (200). When the patterned sacrificial layer (200) is removed, the first part (310) is also removed, and the second part (320) that is left forms a plurality of filters respectively located on these sensing regions (110).

Inventors:
FAN CHEN-CHIH (CN)
CHOU BRUCE C S (CN)
Application Number:
PCT/CN2020/075046
Publication Date:
April 01, 2021
Filing Date:
February 13, 2020
Export Citation:
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Assignee:
EGIS TECH INC (CN)
International Classes:
G02B5/20; H01L27/146
Foreign References:
CN109815783A2019-05-28
CN102789142A2012-11-21
CN204887163U2015-12-16
CN102620826A2012-08-01
CN106910756A2017-06-30
Attorney, Agent or Firm:
NANJING JINGWEI PATENT & TRADEMARK AGENCY CO., LTD (CN)
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