Title:
METHOD FOR MANUFACTURING FILTER FOR SOLID-STATE IMAGING ELEMENT, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/107121
Kind Code:
A1
Abstract:
This method for manufacturing a filter for a solid-state imaging element comprises: forming a color filter on a semiconductor substrate; forming an etching stopper layer on the semiconductor substrate and the color filter; forming an infrared cut precursor layer on the etching stopper layer; forming a resist pattern covering a portion of the infrared cut precursor layer that is positioned over the color filter; and forming an infrared cut filter by subjecting the infrared cut precursor layer to dry etching using the resist pattern. The etch rate for the infrared cut precursor layer during dry etching differs from the etch rate for the etching stopper layer during dry etching.
Inventors:
AKENO YASUTAKE (JP)
IWATA REIKO (JP)
HIRAI YURI (JP)
IWATA REIKO (JP)
HIRAI YURI (JP)
Application Number:
PCT/JP2020/044296
Publication Date:
June 03, 2021
Filing Date:
November 27, 2020
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
G02B5/20; G02B5/22; H01L27/146
Domestic Patent References:
| WO2018211813A1 | 2018-11-22 | |||
| WO2018043654A1 | 2018-03-08 |
Foreign References:
| JP2019180048A | 2019-10-17 | |||
| JP2019200279A | 2019-11-21 |
Other References:
See also references of EP 4067951A4
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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