Title:
METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET, HEAT DISSIPATION SHEET, SUBSTRATE, AND POWER SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2019/117156
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a heat dissipation sheet having heat conductivity, wherein heat conductivity in the thickness direction is enhanced. This method for manufacturing a heat dissipation sheet is provided with a baking step for heating so as to polymerize a polymerizable compound while applying pressure, from the top-bottom direction with respect to the thickness of the heat dissipation sheet, to a composition including an inorganic filler, the polymerizable compound, and a curing agent for curing the polymerizable compound.
Inventors:
KUNINOBU TAKAFUMI (JP)
UJIIYE KENTO (JP)
TAKIZAWA KAZUHIRO (JP)
FUJIWARA TAKESHI (JP)
UJIIYE KENTO (JP)
TAKIZAWA KAZUHIRO (JP)
FUJIWARA TAKESHI (JP)
Application Number:
PCT/JP2018/045535
Publication Date:
June 20, 2019
Filing Date:
December 11, 2018
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C09K5/14; C08L63/00; C08L71/02; H01L23/36; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
| WO2015170744A1 | 2015-11-12 | |||
| WO2013100172A1 | 2013-07-04 |
Foreign References:
| JP2016127046A | 2016-07-11 | |||
| JP2015195287A | 2015-11-05 | |||
| JP2014152299A | 2014-08-25 | |||
| JP2012212727A | 2012-11-01 | |||
| JP2012039061A | 2012-02-23 | |||
| JP2006156725A | 2006-06-15 |
Attorney, Agent or Firm:
MIYAGAWA, Teiji et al. (JP)
Download PDF:
Previous Patent: ANTIVIBRATION RUBBER COMPOSITION, AND ANTIVIBRATION RUBBER
Next Patent: COOLING WATER CONTROL VALVE DEVICE
Next Patent: COOLING WATER CONTROL VALVE DEVICE