Title:
METHOD FOR MANUFACTURING HIGH-DENSITY THREE-DIMENSIONAL PROGRAMMABLE MEMORY
Document Type and Number:
WIPO Patent Application WO/2021/203897
Kind Code:
A1
Abstract:
A method for manufacturing a high-density three-dimensional programmable memory, relating to the memory manufacturing technology, and comprising the following steps: 1) forming a base structure; 2) forming a groove on the base structure; 3) providing, on an inner wall of a separation groove, storage medium layers required by a preset memory structure layer by layer; 4) filling a core medium in the separation groove, so as to form a core medium layer; 5) etching a deep hole along the separation groove filled with the core medium by using a mask-under-etching process, and cutting off the core medium in the separation groove at the position of the deep hole; and 6) filling an insulation medium in the deep hole. Said method has low costs, and can achieve the highest storage density.
Inventors:
PENG JACK ZEZHONG (US)
Application Number:
PCT/CN2021/079887
Publication Date:
October 14, 2021
Filing Date:
March 10, 2021
Export Citation:
Assignee:
CHENGDU PBM TECH LTD (CN)
International Classes:
H01L21/8239; H01L27/115; H01L27/11578
Foreign References:
| CN109686703A | 2019-04-26 | |||
| CN109545787A | 2019-03-29 | |||
| CN109887923A | 2019-06-14 | |||
| CN108140644A | 2018-06-08 | |||
| US20090321878A1 | 2009-12-31 |
Attorney, Agent or Firm:
CHENGDU HUIDI PATENT LAW OFFICE (GENERAL PARTNERSHIP) (CN)
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