Title:
METHOD OF MANUFACTURING HONEYCOMB SOLID-LIQUID COMPOSITE HEAT DISSIPATION MATERIAL FOR CPU HEAT DISSIPATION
Document Type and Number:
WIPO Patent Application WO/2021/081799
Kind Code:
A1
Abstract:
Disclosed is a honeycomb solid-liquid composite heat dissipation material for CPU heat dissipation and a manufacturing method therefor. The heat dissipation material consists of two parts: a matrix part that is 55-80 parts by weight of a P(VDF-TrFE) copolymer having a plurality of honeycomb through holes inside, and a filler part that is cured inside the matrix part and is a blend of three components, comprising 15-20 parts of polymethyl methacrylate, 25-35 parts of ethylene-vinyl acetate, and 15-25 parts of graphite powder. The present invention does not require adhesives, and features a large specific surface area, fast heat dissipation, simultaneous multiple heat dissipation methods, weather resistance, oxidation resistance, and dry cracking resistance.
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Inventors:
ZHANG JINGMIN (CN)
Application Number:
PCT/CN2019/114312
Publication Date:
May 06, 2021
Filing Date:
October 30, 2019
Export Citation:
Assignee:
CHUXIN DIGITAL TECH CO LTD (CN)
International Classes:
C09K5/14; C08F2/44; C08F214/20; C08F214/22; C08F218/08; C08F220/14; C08K3/04
Domestic Patent References:
| WO2014204245A2 | 2014-12-24 |
Foreign References:
| CN107760278A | 2018-03-06 | |||
| CN105755307A | 2016-07-13 | |||
| CN105367961A | 2016-03-02 | |||
| CN103113668A | 2013-05-22 | |||
| CN102181168A | 2011-09-14 |
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