Title:
METHOD FOR MANUFACTURING LAYERED SUBSTRATE, AND LAYERED SUBSTRATE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/191117
Kind Code:
A1
Abstract:
The present invention increases the strength of a joined surface between a resin substrate and a resin sheet, and reduces the profile of a layered substrate while high flatness is ensured. A concave part (4A) is provided to a portion of the principal plane of a first resin layer (4). A B-stage resin sheet which will become a second resin layer (5) is crimped to the principal plane of the first resin layer (4), and the resin material that is to become the second resin layer (5) is made to flow into the concave part (4A). The B-stage resin sheet, including the resin material which has flowed into the concave part, is cured to form the second resin layer (5).
Inventors:
HATASE MINORU (JP)
Application Number:
PCT/JP2013/066545
Publication Date:
December 27, 2013
Filing Date:
June 17, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; B32B37/10
Foreign References:
| JP2011176111A | 2011-09-08 | |||
| JP2010103520A | 2010-05-06 | |||
| JPH07202433A | 1995-08-04 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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