Title:
METHOD FOR MANUFACTURING LOW-HEAT RESISTANT SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/075249
Kind Code:
A1
Abstract:
[Problem] To provide a method for manufacturing a low-heat resistant sensor which is highly chemical resistant and highly drip and dust proof. [Solution] This method for manufacturing a low-heat resistant sensor includes at least: a step for disposing a sensor unit in a recess of a storage member made of a fluorocarbon resin, inserting a cable through a through-hole leading to the recess, and electrically connecting the cable and the sensor unit disposed in the recess; a step for disposing a plate made of a fluorocarbon resin so as to cover the opening of the recess and to provide a lid for the recess; a step for covering the cable with a tube made of a fluorocarbon resin; a step for disposing a frame body made of a fluorocarbon resin so as to enclose the periphery of the plate; a step for heat-joining the frame body, the storage member, and the plate; and a step for heat-joining the storage member and the tube.
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Inventors:
SATOH HISATAKA (JP)
KOMEDA TETSUYA (JP)
KOMEDA TETSUYA (JP)
Application Number:
PCT/JP2020/036580
Publication Date:
April 22, 2021
Filing Date:
September 28, 2020
Export Citation:
Assignee:
VALQUA LTD (JP)
International Classes:
G01D11/24
Foreign References:
| JP2004009318A | 2004-01-15 | |||
| JP2012032363A | 2012-02-16 | |||
| JP2005285501A | 2005-10-13 | |||
| JPH01170929U | 1989-12-04 | |||
| JP2017092192A | 2017-05-25 | |||
| US4605818A | 1986-08-12 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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