Title:
METHOD FOR MANUFACTURING METALLIC MEMBER-RESIN MEMBER BONDED BODY, AND FILM
Document Type and Number:
WIPO Patent Application WO/2022/130833
Kind Code:
A1
Abstract:
Provided is a method for easily manufacturing a metal-polyolefin bonded body having high bonding strength. This method for manufacturing a metallic member-resin member bonded body comprises: preparing a film that includes at least one modified polyolefin layer selected from the group consisting of a layer containing a reaction product 1 of a maleic anhydride-modified polyolefin, a bifunctional epoxy resin, and a bifunctional phenol compound, a layer containing a reaction product 2 of a maleic anhydride-modified polyolefin and a thermoplastic epoxy resin, and a layer containing a mixture of a polyolefin and a thermoplastic epoxy resin; disposing the film on at least a part of the surface of a metallic substrate so as to expose the modified polyolefin layer, thereby forming a metallic member in which a resin coating layer is laminated on the metallic substrate; and bonding a resin member onto the resin coating layer of the metallic member.
Inventors:
TAKAHASHI NOBUYUKI (JP)
SATO MASAHIRO (JP)
OTANI KAZUO (JP)
SATO MASAHIRO (JP)
OTANI KAZUO (JP)
Application Number:
PCT/JP2021/041191
Publication Date:
June 23, 2022
Filing Date:
November 09, 2021
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
B29C65/02; B29C65/04; B29C65/06; B29C65/08; B29C65/16; B29C65/18; B32B15/085
Domestic Patent References:
WO2017170445A1 | 2017-10-05 | |||
WO2016199339A1 | 2016-12-15 | |||
WO2016199339A1 | 2016-12-15 | |||
WO2016152118A1 | 2016-09-29 |
Foreign References:
JP2018154034A | 2018-10-04 | |||
JPS59196242A | 1984-11-07 | |||
JP2018131553A | 2018-08-23 | |||
JP2020033484A | 2020-03-05 | |||
JP2016016584A | 2016-02-01 | |||
JP2018154034A | 2018-10-04 |
Other References:
"Polyester Resin Handbook", 1988, THE NIKKAN KOGYO SHIMBUN, LTD.
"Paint Glossary", 1993, THE JAPAN SOCIETY OF COLOR MATERIAL
"Paint Glossary", 1993, THE JAPAN SOCIETY OF COLOR MATERIAL
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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