Title:
METHOD FOR MANUFACTURING MOULD ASSEMBLY, METHOD FOR PRODUCING PATTERNED SHEET, METHOD FOR MANUFACTURING ELECTROFORMED MOULD, AND METHOD FOR MANUFACTURING SECOND MOULD USING ELECTROFORMED MOULD
Document Type and Number:
WIPO Patent Application WO/2017/056893
Kind Code:
A1
Abstract:
This method for manufacturing a mould assembly 100 is provided with: a manufacturing step in which an original plate 10 having a protruded pattern 10A is used to manufacture a plurality of resin first moulds 20 having a recessed pattern 20A which has the inverse shape to the protruded pattern 10A of the original plate 10; an arrangement step in which the plurality of first moulds 20 are arranged on a first substrate 30 in a state in which the plurality of first moulds are separated from each other, and the recessed pattern surfaces of the first moulds 20 are in contact with the first substrate 30; a supply step in which an adhesive 40 is supplied to the spaces between the plurality of first moulds 20, and cured, and an additional adhesive 42 is subsequently supplied to the surfaces of the plurality of first moulds 20 opposite to the recessed pattern surfaces; a bonding step in which the adhesive 42 is used to bond a second substrate 50 to the side of the surfaces of the plurality of first moulds 20 opposite to the recessed pattern surfaces; and a substrate separation step in which, after the second substrate 50 has been bonded, the plurality of first moulds 20 and the first substrate 30 are separated.
Inventors:
OGAWA SHOTARO (JP)
KIDO TAKEO (JP)
KIDO TAKEO (JP)
Application Number:
PCT/JP2016/076339
Publication Date:
April 06, 2017
Filing Date:
September 07, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B81C99/00; A61M37/00; B29C33/42; B29C43/52
Domestic Patent References:
| WO2014175310A1 | 2014-10-30 |
Foreign References:
| JP2009233170A | 2009-10-15 | |||
| JP2011245055A | 2011-12-08 | |||
| JPH09183128A | 1997-07-15 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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