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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/109982
Kind Code:
A1
Abstract:
According to the present invention, formed on a semiconductor substrate (1) is a ridge structure (9) that has: a ridge lower part (6); and a ridge upper part (8) disposed over the ridge lower part (6) and having a greater width than the ridge lower part (6). A recessed location (11) of the ridge structure (9) is completely embedded by an insulation film (10) by means of atomic layer deposition, the recessed location (11) being produced by means of the ridge lower part (6) being recessed in a lateral direction with respect to the ridge upper part (8) due to the difference in the widths of the ridge lower part (6) and the upper ridge part (8), whereby a convex shape (19) having no steps on the side surfaces is formed by the semiconductor substrate (1), the ridge structure (9), and the insulation film (10).

Inventors:
YAMAGUCHI TSUTOMU (JP)
Application Number:
PCT/JP2017/030175
Publication Date:
June 21, 2018
Filing Date:
August 23, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/22
Foreign References:
JP5454381B22014-03-26
US5851849A1998-12-22
JP2014179389A2014-09-25
JPH02156588A1990-06-15
JP2014007295A2014-01-16
JPH04242981A1992-08-31
JP2016129244A2016-07-14
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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