Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD HAVING TEST POINT, AND PRINTED CIRCUIT BOARD MANUFACTURED THEREBY
Document Type and Number:
WIPO Patent Application WO/2019/151752
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a printed circuit board having a test point, and a printed circuit board manufactured thereby, the method being capable of: forming pads having a pitch interval smaller than the interval of a conventional pitch by electrically connecting test points and pads, after the test points and the pads are formed on the printed circuit board; contributing to the miniaturization of the printed circuit board by allowing a connector, which is smaller than a conventional connector, to be mounted therein, and using, as is, the preformed test point after the connector is used in the printed circuit board and is removed therefrom.

Inventors:
KIM JEONG WAN (KR)
Application Number:
PCT/KR2019/001250
Publication Date:
August 08, 2019
Filing Date:
January 30, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
H05K1/02; H01R12/57; H05K1/11
Foreign References:
KR20140134812A2014-11-25
KR20070065152A2007-06-22
JPH11251706A1999-09-17
KR20170020002A2017-02-22
KR20040110033A2004-12-29
KR20180011171A2018-01-31
Other References:
See also references of EP 3637962A4
Attorney, Agent or Firm:
CHUNG, Soon-Sung (KR)
Download PDF: