Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER WITH ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2023/017832
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a semiconductor device using an adhesive sheet for semiconductor processing having a base material, an intermediate layer, and an adhesive layer in that order, one or more layers selected from the group consisting of the base material, the intermediate layer, and the adhesive layer being a thermal expansion layer containing thermal expansion particles, and the method for manufacturing the semiconductor device including steps 1-4.
Inventors:
KAKIUCHI YASUHIKO (JP)
Application Number:
PCT/JP2022/030513
Publication Date:
February 16, 2023
Filing Date:
August 10, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; C09J5/00; C09J7/29; C09J7/38; C09J201/00
Foreign References:
| JP2005116610A | 2005-04-28 | |||
| JP2005019666A | 2005-01-20 | |||
| JP2017103441A | 2017-06-08 | |||
| JP2013087131A | 2013-05-13 | |||
| JP2013021017A | 2013-01-31 | |||
| US6794751B2 | 2004-09-21 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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