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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/065810
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a semiconductor device comprising a common support substrate and a plurality of semiconductor elements. The method comprises: an inspection step for measuring, with respect to each of a plurality of semiconductor elements 101-104 supported side by side on a common support substrate 20, a predetermined electrical parameter and determining whether a measured value satisfies a predetermined condition; and an electrode forming step for forming an electrode film 22 which is, among the plurality of semiconductor elements, electrically connected to semiconductor elements that have passed the inspection in the inspection step and electrically insulated from a semiconductor element that has failed the inspection in the inspection step, in a state such that the electrode film 22 is continuous across projected surfaces on an electrode film arranging surface 22A including projected surfaces A1, A2, A3 of the semiconductor elements that have passed the inspection and a projected surface B1 of the semiconductor element that has failed the inspection, the semiconductor elements still being supported on the common support substrate.

Inventors:
SAWADA, Tatsuro (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, JP)
Application Number:
JP2020/036662
Publication Date:
April 08, 2021
Filing Date:
September 28, 2020
Export Citation:
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Assignee:
KYOCERA CORPORATION (Fushimi-ku Kyoto-sh, Kyoto 01, JP)
International Classes:
H01L25/07; H01L25/18; H01L25/04; H01L21/02; H01L21/20; H01L21/66; H01L29/872; H01L21/329
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (17F. Tokyo Takarazuka Bldg., 1-1-3, Yurakucho, Chiyoda-k, Tokyo 06, JP)
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