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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND MOLD-RELEASING FILM FOR SEMICONDUCTOR PACKAGE MANUFACTURING PROCESS
Document Type and Number:
WIPO Patent Application WO/2017/130952
Kind Code:
A1
Abstract:
A method for manufacturing a semiconductor package. A mold-releasing film 21 is disposed on a surface of a cavity 14 to be filled with a thermosetting resin 27 for manufacturing a package in a mold 11 with an element 25 to be packaged installed therein, and then the thermosetting resin 27 is filled into the mold 11. In this case, as the mold-releasing film 21, a laminate film is used in which a base material film disposed on the cavity 14 surface side and a peeling resin disposed on the thermosetting resin side are laminated. As the base material film, an oriented polyester film having two or more melting points not lower than a mold setting temperature is used.

Inventors:
YAMAMOTO MASAFUMI
Application Number:
PCT/JP2017/002314
Publication Date:
August 03, 2017
Filing Date:
January 24, 2017
Export Citation:
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Assignee:
UNITIKA LTD (JP)
International Classes:
H01L21/56; B29C33/68; B29C39/22; B32B27/00; B32B27/36
Foreign References:
JP2011230289A2011-11-17
JP2012066586A2012-04-05
JP2011194702A2011-10-06
JP2009172864A2009-08-06
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
Patent business corporation Morimoto international patent firm (JP)
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