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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING THINNED WAFERS AND DEVICE FOR MANUFACTURING THINNED WAFERS
Document Type and Number:
WIPO Patent Application WO/2021/153265
Kind Code:
A1
Abstract:
This device for manufacturing thinned wafers is capable of subjecting a thinned wafer to various processes while preventing damage to the thinned wafer, and comprises: a separating means 10 which forms a weakness layer WL on a semiconductor wafer WF supported by a substrate supporting means BS, divides the semiconductor wafer WF into a thinned wafer WF1 and a remaining wafer WF2 at the weakness layer WL, and separates the remaining wafer WF2 from the thinned wafer WF1; a first delivery means 20 which delivers the thinned wafer WF1 from which the remaining wafer WF2 has been separated by the separating means 10; a processing means 30 which subjects the thinned wafer WF1 delivered by the first delivery means 20 to a predetermined process; a second delivery means 40 which delivers the thinned wafer WF1 that has been subjected to the predetermined process by the processing means 30; and a reinforcing member affixing means 50 which affixes a reinforcing member AS to the thinned wafer WF1 delivered by the second delivery means 40. The first delivery means 20 and the second delivery means 40 deliver the thinned wafer WF1 together with the substrate supporting means BS.

Inventors:
IZUMI NAOFUMI (JP)
Application Number:
PCT/JP2021/001165
Publication Date:
August 05, 2021
Filing Date:
January 15, 2021
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B28D7/04; B23K26/53; B28D5/04; H01L21/304; H01L21/683
Foreign References:
JP2016035965A2016-03-17
JP2019016691A2019-01-31
JP2019016692A2019-01-31
Attorney, Agent or Firm:
YAMAZAKI, Takahiro et al. (JP)
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